This outstanding device that will make reballing easier and faster. Just set the maximum temperature for your device and place BGA on its radiator lying on top of the ceramic plate. Because the hot plate temperature set by the user is limited to the value exact, there is a risk of thermal damage to the BGA. It is very easy to set the temperature a few degrees, well within safe operating temperatures ideal reflow balls. Now anyone can Reball as an expert.
Another way to use this device when you remove the BGA from the motherboard for reballing. Removed BGA should be cleaned old solder, before new solder balls can be placed on the device using Reball jig. , A common way to use a soldering iron and solder wick, which is potentially risky operations can damage the pads, or track how well the solder mask due to the abrasive nature of the solder wick and a soldering iron.
The INSAT, we have developed a technique that simplifies this process, and to reduce any risk of friction damage to the solder wick and a soldering iron. How? so easy with our HT-1212 and the instructions that come when you buy this incredible little BGA Hot Stove.
We have also developed the best way to clean PCB pads using this amazing hot plate with the help of a hot air gun.
You remove the solder on the circuit board in a remarkably short time, without prejudice to the pads or tracks or solder mask. This gentle way to clean BGA and PCB when reballing.
You’ve never seen a vacuum cleaner in the BGA pads after using our technology. The device will look like new, with not a trace of any left-over solder. Clear BGA seconds, more than ever before.
Operating voltage: 220 VAC
Max heating power: 400 W
Temperature range: 25C 300C
Temperature fluctuations: ± 1s
Heating Plate Size: 120x120x15 mm
Net weight: 2.6 kg